All multilayer PCBs require Plated Through Holes (vias) to create connections between the top and bottom layers, and in the case of 3 layers and up PCB’s, between outer and inner layers. This is done using mechanical or laser drills.
Our mechanical drilling modules use automated optical positioning systems for precision and are equipped with high-speed spindles. The drill bits are handled with automated changing systems and laser-inspected to ensure the maximum quality in the drilled holes.
With vias of a very small diameter, use of mechanical drill bits increase the chances of breakage thus increasing scrap costs. Laser drilling is a process that uses highly concentrated energy to create microvias and is used in place of mechanical drilling for precision in creating the smaller vias, which can be <50 microns.