At GreenSource, we have two approaches to creating the circuits: a) Direct Image, Print-and-Etch(DIPAE) b) modified semi-additive processing (mSAP) and SAP. The path selected is based on the presented technology. Our multiple process options afford us the ability to flex to the best option.
Our chemical technologies afford us safe (low free acid) operating conditions while delivering sharper side walls relative to the normal high acid solutions; further, our alkaline etching technology allows for improved processing specifically of resistor material and soldered surfaces.
Combined with our imaging technology, our processes allow us to achieve sub-25um line and space features. Future development will be to add automation to the SAP process as proof of concept has evolved.